DDR2 memory technology provides power savings of about 40% compared to DDR at enhanced operating
speeds due to its reduced supply voltage of standard 1.8V. In addition, new power saving features
like the "Low Power Active Power-Down Mode" are available with DDR2 memory technology enabling
significantly increased battery lifetimes.
Qimonda's 4GB SO-DIMMs are based on the new Dual-Die packaging technology: Two identical dies
are stacked in one FBGA (Fine Ball Grind Array) package. This leads to a package size that is
virtually identical to a single die package. In addition the package offers excellent thermals and
is mechanically extreme robust. Dual-Die-Technology is pre-requisite to manufacture next
generation, high-density modules without significantly increasing their dimensions.
For ultramobile computing designs with utmost mobility and optimized thermal characteristics,
Qimonda is supporting also very low power DDR2 parts at a reduced nominal operating voltage of
1.50V. These parts offer a ~25% lower power consumption compared to standard DDR2 1.8V at the same
performance level. Such very low power DDR2 parts are available in all relevant speeds and form
factors for mobile platforms, such as SO-DIMMs, Micro-DIMMs and 1G components.
